SolaEon Sets 27.87% Perovskite Cell Record

• SolaEon hits certified 27.87% perovskite record, nears theoretical limit; tandem tops 31%, and meter-scale modules reach 25%+ stabilized—mass production hurdles next.

SolaEon set a record 27.87% efficiency for a single-junction perovskite solar cell, certified by China’s National Photovoltaic Industry Metrology and Testing Center. The 0.076 cm² lab-scale device posted an 87.61% fill factor. The mark edges closer to the 33% theoretical limit but remains a lab result, with scale-up and manufacturing hurdles ahead.

In April 2025, SolaEon reported all-perovskite tandem cells topping 31%. In June, a 1.2 m × 0.6 m single-junction module was certified at 20.7% over 0.72 m² (149 W) and 21.88% over 0.64 m² (140 W). In September, it announced 25.27% stabilized efficiency on 0.72 m², 25.47% reverse-scan.

How will SolaEon scale 27.87% lab cells into stable, bankable large-area modules?

• Industrialize uniform large‑area deposition: transition from spin‑coating to slot‑die, blade, or vacuum hybrid routes; implement controlled crystallization (temperature/solvent/antisolvent‑free) with in‑line IR/air‑knife drying to keep film morphology consistent across meter‑scale substrates.
  
• Engineer stack for scale: migrate to sputter‑ or solution‑processed transport layers compatible with large‑area tools; replace lab gold with low‑cost Cu/Ag/Al/carbon electrodes and robust transparent conductors; tune 2D/3D perovskite interfaces and passivation to preserve Voc and fill factor at aperture scale.
  
• Suppress shunts and resistive losses: cleanroom web handling, particle control, and substrate prep; introduce wide‑process‑window chemistries and defect‑tolerant formulations; integrate ALD/PECVD ultra‑thin barriers to curb ion migration and sputter damage.
  
• Optimize laser interconnection: narrow, uniform P1/P2/P3 scribes, high‑speed galvanometer heads, and precision registration to cut dead area; low‑resistance interconnect pastes and busbar designs to raise cell‑to‑module (CTM) efficiency.
• Encapsulation for longevity: glass–glass architecture, high‑performance edge seals and moisture/oxygen barriers; UV and thermal stabilizers; lead‑containment films and capture features for breakage scenarios to meet environmental requirements.
  
• Reliability and certification path: design to pass and exceed IEC 61215/61730 (damp heat, thermal cycling, humidity freeze, PID, UV, mechanical load, hail); run extended stress (e.g., 2,000+ h damp heat, 600+ cycles) and outdoor pilots across climates to validate <1%/year target degradation.
  
• Process control and yield: deploy in‑line metrology (ellipsometry, PL/EL imaging, sheet‑resistance maps), SPC, and fault detection; MES‑driven traceability from slurry to module; rapid feedback loops to lift first‑pass yield and minimize variability.
  
• Scalable equipment set: pilot a 0.5–1 GW line with modular coaters, dryers, sputter, lamination, and laser tools; design for roll‑to‑roll or sheet‑to‑sheet with future tandem compatibility; negotiate tool recipes with vendors for uptime and maintenance.
  
• Supply chain and materials: secure high‑purity precursors, solvents, and barrier films at volume; qualify multiple suppliers; implement solvent recovery and waste treatment to lower OPEX and meet ESG goals.
  
• Bankability package: third‑party performance and reliability data, independent energy‑yield assessments, insurance wrap, robust warranties, and a recycling/take‑back plan; publish field fleet statistics and finance models to support project debt.
• Productization choices: standardize glass‑glass formats for utility and rooftop; consider bifacial/back‑contact variants where feasible; thermal management and UV‑filtering for hot/high‑irradiance sites.
• Road‑mapping CTM and uptime: set quantified gates for CTM loss, yield, uptime, and cost/W targets per scale step (lab → pilot → mass); maintain parallel tracks for single‑junction and tandem, selecting the first to meet LCOE and reliability thresholds.