Mellow Energy Hits 21.13% on 30x30cm Flexible Perovskite

• Mellow Energy’s 30×30 cm flexible perovskite hits TÜV NORD–certified 21.13% efficiency, a size-class record, accelerating real-world pilots from gadgets to vehicles, aerospace and satellites toward rapid commercialization.

Perovskite maker Mellow Energy, also known as Vein Energy, said its 30×30 cm² flexible perovskite solar module hit a 21.13% power conversion efficiency, a result TÜV NORD certified. The company said the figure is a record for flexible modules at that area, underscoring progress toward commercial-grade performance in next-gen thin-film photovoltaics.

Mellow Energy said it is fast-tracking demonstrations and deployments in consumer electronics, mobile power, vehicle-integrated PV, aerospace and satellites to speed scale-up and commercialization. In September, the company reported a 24.36% efficiency on a 30×30 cm perovskite module, highlighting rapid gains across its large-area devices.

What manufacturing advances enabled TÜV-certified 21.13% efficiency on 30×30 cm flexible perovskites?

• Roll-to-roll slot‑die/blade coating scaled to 30×30 cm with in‑line gas‑knife/air‑knife crystallization for uniform films and large grain size across the sheet
  
• Solvent and drying engineering (controlled humidity/temperature, anti‑solvent timing replacement with gas/quench steps) to suppress pinholes and phase segregation
  
• Low‑temperature, rapid photonic/IR annealing compatible with polymer substrates to densify films without heat‑warping
  
• Multi‑cation/halide perovskite recipes with passivating additives (alkali and bulky ammonium species) to cut non‑radiative recombination
  
• Interface passivation via self‑assembled monolayers and optimized ETL/HTL stacks (doped fullerene and nickel‑oxide variants) to boost Voc and fill factor
  
• Flexible transparent electrodes upgraded to low‑resistance stacks (ITO/Ag/ITO or oxide–metal–oxide, or Ag‑mesh + oxide) to lower sheet resistance without sacrificing bendability
  
• Precision P1‑P2‑P3 laser scribing with tighter line widths and alignment to shrink dead area and series resistance in monolithic interconnects
• Improved busbar/current‑collection layout and conductive adhesives to minimize ohmic losses on flexible foils
  
• Ultra‑barrier encapsulation (ALD nanolaminate + polymer multilayers) and advanced edge seals to meet moisture/oxygen ingress targets required for third‑party certification
  
• In‑line EL/PL/IV mapping with feedback control to stabilize process windows and weed out defect zones before lamination
  
• Strain‑management layers and neutral‑axis stack design to preserve contact integrity and performance under flex
  
• Cleaner manufacturing environment (oxygen/humidity control, solvent purity, particulate control) to reduce trap density and improve yield